Description: RF and Microwave Microelectronics Packaging, Hardcover by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1441909834, ISBN-13 9781441909831, Like New Used, Free P&P in the UK This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
Price: 125.98 GBP
Location: Castle Donington
End Time: 2024-12-04T03:59:10.000Z
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Book Title: RF and Microwave Microelectronics Packaging
Number of Pages: 285 Pages
Language: English
Publication Name: Rf and Microwave Microelectronics Packaging
Publisher: Springer-Verlag New York Inc.
Publication Year: 2009
Subject: Engineering & Technology, Physics
Item Height: 235 mm
Item Weight: 1330 g
Type: Textbook
Author: Ken Kuang, Franklin Kim, Sean S. Cahill
Subject Area: Manufacturing Engineering
Item Width: 155 mm
Format: Hardcover
