Description: Packaging of High Power Semiconductor Lasers, Hardcover by Liu, Xingsheng; Zhao, Wei; Xiong, Lingling; Liu, Hui, ISBN 1461492629, ISBN-13 9781461492627, Like New Used, Free P&P in the UK This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
Price: 187 GBP
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End Time: 2024-08-29T00:58:05.000Z
Shipping Cost: 20.45 GBP
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Book Title: Packaging of High Power Semiconductor Lasers
Item Height: 235 mm
Item Width: 155 mm
Series: Micro- and Opto-Electronic Materials, Structures, and Systems
Author: Wei Zhao, Lingling Xiong, Xingsheng Liu, Hui Liu
Publication Name: Packaging of High Power Semiconductor Lasers
Format: Hardcover
Language: English
Publisher: Springer-Verlag New York Inc.
Subject: Engineering & Technology
Publication Year: 2014
Type: Textbook
Item Weight: 842 g
Number of Pages: 402 Pages
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