Description: Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.Weight: 1.0g/tubeOperation Temperature: -50/180°cThermal Conductivity: >3.05W/m.k, Thermal Resistance: <0.073°c-in2/w20% metal oxide compounds This item is being shipped without tracking number.
Price: 2.95 USD
Location: Duluth, Georgia
End Time: 2024-09-19T22:00:28.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Brand: Unbranded
Type: Thermal Compound
Packaging: Blister Pack
MPN: Does Not Apply
Country/Region of Manufacture: China
